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High-power semiconductor refrigeration sheet TEC1-12710

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TEC1-12710
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High-power semiconductor refrigeration sheet TEC1-12710

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Product Description

 High-power semiconductor refrigeration sheet TEC1-12710

 

Chip type: TEC1-12710
Size: 40*40*3.4mm±0.2   Component log: 127
wire: Tin plating on 300±5mm RV standard conductor with 5 mm lead length
Internal resistance: 1.2~1.5Ω(ambient temperature 23±1℃, 1kHZ Ac test)
TD MAX: Tmax(Qc=0)above 60℃
Working current: Imax=10A(15Vmax Voltage Start-up)
Rated voltage: DC12V(Vmax:15.5V)
Refrigeration power: Qcmax 92W
Assembly pressure: 85N/cm2
Working environment: Temperature range-55℃~83℃(excessive ambient temperature drop directly affects refrigeration efficiency)
Packaging process: Surrounding Standard 704 Silicone Rubber Seal
Packaging standards: Foam box packaging, storage conditions, ambient temperature-10℃~40℃
Storage conditions: -40~60℃

High-power semiconductor refrigeration sheet TEC1-12710High-power semiconductor refrigeration sheet TEC1-12710

 

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