Power Management ICs
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Hot sale original XC6SLX75-3CSG484I IC Field Programmable Gate Array, 5831 CLBs, 862MHz, 74637-Cell, CMOS, PBGA484, 19 X 19 MM
Manufacturer Product Number
XC6SLX75-3CSG484I
Description
XC6SLX75-3CSG484I IC Field Programmable Gate Array, 5831 CLBs, 862MHz, 74637-Cell, CMOS, PBGA484, 19 X 19 MM
Package Condition
Tray
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Product Details
| XC6SLX75-3CSG484I Description The Spartan®-6 family provides leading system integration capabilities with the lowest total cost for high-volume applications. The thirteen-member family delivers expanded densities ranging from 3,840 to 147,443 logic cells, with half the power consumption of previous Spartan families, and faster, more comprehensive connectivity. Built on a mature 45 nm low-power copper process technology that delivers the optimal balance of cost, power, and performance, the Spartan-6 family offers a new, more efficient, dual-register 6-input lookup table (LUT) logic and a rich selection of built-in system-level blocks. These include 18 Kb (2 x 9 Kb) block RAMs, second generation DSP48A1 slices, SDRAM memory controllers, enhanced mixed-mode clock management blocks, SelectIO™ technology, power optimized high-speed serial transceiver blocks, PCI Express® compatible Endpoint blocks, advanced system-level power management modes, auto-detect configuration options, and enhanced IP security with AES and Device DNA protection. These features provide a low cost programmable alternative to custom ASIC products with unprecedented ease of use. Spartan-6 FPGAs offer the best solution for high-volume logic designs, consumer-oriented DSP designs, and cost-sensitive embedded applications. Spartan-6 FPGAs are the programmable silicon foundation for Targeted Design Platforms that deliver integrated software and hardware components that enable designers to focus on innovation as soon as their development cycle begins. XC6SLX75-3CSG484I Features • Spartan-6 Family: • Spartan-6 LX FPGA: Logic optimized • Spartan-6 LXT FPGA: High-speed serial connectivity • Designed for low cost • Multiple efficient integrated blocks • Optimized selection of I/O standards • Staggered pads • High-volume plastic wire-bonded packages • Low static and dynamic power • 45 nm process optimized for cost and low power • Hibernate power-down mode for zero power • Suspend mode maintains state and configuration with multi-pin wake-up, control enhancement • Lower-power 1.0V core voltage (LX FPGAs, -1L only) • High performance 1.2V core voltage (LX and LXT FPGAs, -2, -3, and -4 speed grades) • Multi-voltage, multi-standard SelectIO™ interface banks • Up to 1,050 Mb/s data transfer rate per differential I/O • Selectable output drive, up to 24 mA per pin • 3.3V to 1.2V I/O standards and protocols • Low-cost HSTL and SSTL memory interfaces • Hot swap compliance • Adjustable I/O slew rates to improve signal integrity • High-speed GTP serial transceivers in the LXT FPGAs • Up to 3.125 Gb/s • High-speed interfaces including: Serial ATA, Aurora, 1G Ethernet, PCI Express, OBSAI, CPRI, EPON, GPON, DisplayPort, and XAUI • Integrated Endpoint block for PCI Express designs (LXT) • Low-cost PCI® technology support compatible with the 33 MHz, 32- and 64-bit specification. • Efficient DSP48A1 slices • High-performance arithmetic and signal processing • Fast 18 x 18 multiplier and 48-bit accumulator • Pipelining and cascading capability • Pre-adder to assist filter applications |
Product Description
| Type# | Description |
| ANSC PART# | ANSC - XC6SLX75-3CSG484I |
| Ihs Manufacturer | / |
| Part Package Code | BGA |
| Package Description | FBGA, BGA484,22X22,32 |
| Pin Count | 484 |
| Clock Frequency-Max | 862 MHz |
| Combinatorial Delay of a CLB-Max | 0.21 ns |
| Length | 19 mm |
| Moisture Sensitivity Level | 3 |
| Number of CLBs | 5831 |
| Number of Inputs | 328 |
| Number of Logic Cells | 74637 |
| Number of Outputs | 328 |
| Number of Terminals | 484 |
| Operating Temperature-Max | 100 °C |
| Operating Temperature-Min | -40 °C |
| Organization | 5831 CLBS |
| Package Body Material | PLASTIC/EPOXY |
| Package Code | FBGA |
| Package Equivalence Code | BGA484,22X22,32 |
| Package Shape | SQUARE |
| Package Style | GRID ARRAY, FINE PITCH |
| Peak Reflow Temperature (Cel) | 260 |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY |
| Qualification Status | Not Qualified |
| Seated Height-Max | 1.8 mm |
| Supply Voltage-Max | 1.26 V |
| Supply Voltage-Min | 1.14 V |
| Supply Voltage-Nom | 1.2 V |
| Surface Mount | YES |
| Technology | CMOS |
| Temperature Grade | INDUSTRIAL |
| Terminal Finish | Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) |
| Terminal Form | BALL |
| Terminal Pitch | 0.8 mm |
| Terminal Position | BOTTOM |
| Time@Peak Reflow Temperature-Max (s) | 30 |
| Width | 19 mm |
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XC6SLX75-3CSG484I IC Field Programmable Gate Array, 5831 CLBs, 862MHz, 74637-Cell, CMOS, PBGA484, 19 X 19 MM
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