Image shown is a representation only.

Exact specifications should be obtained from the product data sheet.

One stop electronic component supply Original DS38E16SBB-9MGB 2Gb DDR3L SDRAM FLASH IC CHIP FBGA 96

Manufacturer Product Number
DS38E16SBB-9MGB
Description

DS38E16SBB-9MGB-Nominal and dynamic on-die termination (ODT) for data, strobe, and mask signals

- Programmable CAS (READ) latency (CL)

- Programmable CAS additive latency (AL)

- Programmable CAS (WRITE) latency (CWL)

Package Condition
Tray

Product Features

- VDD/VDDQ = 1.35V (1.283V to 1.45V)

- Backward compatible to VDD = VDDQ = 1.5V ±0.075V

- 8n-bit prefetch DDR architecture

- Differential clock inputs (CK, CK#)

- 8 internal banks 

- Nominal and dynamic on-die termination (ODT) for data, strobe, and mask signals

- Programmable CAS (READ) latency (CL)

- Programmable CAS additive latency (AL)

- Programmable CAS (WRITE) latency (CWL)

- Fixed burst length (BL) of 8 and burst chop (BC) of 4(via the mode register set [MRS])

- Selectable BC4 or BL8 on–the-fly (OTF)

- Self refresh mode

- Tc of 0℃ to +95℃

∙ 64ms, 8192 cycle refresh at 0℃ to +85℃

∙ 32ms at 85℃ to +95℃

- Self refresh temperature (SRT)

- Automatic self refresh (ASR)

- Write leveling

- Multipurpose register

- Output driver calibration 

• Configuration

- 128 Meg X 16 (16 Meg X 16 X 8 Banks).

• Timing – Cycle time

- 1.07ns @ CL = 13 (-9M)

- 1.25ns @ CL = 11 (-8K)

- 1.50ns @ CL = 9 (-6H)

- 1.87ns @ CL = 7 (-5F)

• Operating Temperature Ranges

- Commercial (0℃ to +95℃)

- Industrial (-40℃ to +95℃)

  Specifications

Attribute Attribute value
ANSM-Part# ANSM-DS38E16SBB-9MGB
Type: DDR3
Manufactor Dosilicon
DC Standard
Describe NEW
Supplier Device Packaging FBGA96
Package TRAY
Density 2Gb
Voltage (V) 1.5V
Speed (MHz/CLK) 933MHz
Temp.Range -40℃~95℃

Actual product photos

FBGA96

Product Data Book:

1702713555b9322a.png

170271355590b8e0.png

1702713555f8b436.png

170271355509b2d8.png

170271355562bcf3.png

For more product information, please download the PDF

Payment&Transportation

详情8.1

Official Certificate&Certificate

详情页3.1

Multiple product supply

详情5.1

Company office environment

详情6.1

Warehouse Real Shot

170019007688325e.png

Standard packaging

详情9

We also provide :

Part No Manufacturer Date Code Quantity Description
LM22676ADJ NS 19+ 250 SOP8
TPS562201DDCR TI 22+ 795500 SOT23-6
NJG1806K75 JRC 22+ 500000 DFN6
TLV74318PDQNR TI 22+ 402000 X2SON-4
NJG1801K75 JRC 22+ 300000 SMD
NJG1804K64 JRC 22+ 300000 DFN8
LM27761DSGR TI 22+ 151000 WSON8
TLV62565DBVR TI 22+ 138000 SOT23-5
TPS613222ADBVR TI 22+ 108000 SOT23-5
LNK625DG-TL POWER 22+ 100000 SOP-8
OPA4322AIPWR TI 22+ 100000 TSSOP14
TLV75528PDRVR TI 22+ 99000 WSON-6
TPS7A2025PDQNR TI 22+ 78500 X2SON-4
TLV62568DBVR TI 22+ 72000 SOT23-5
STM32L051K8U6TR ST 22+ 60000 QFN32
SKY66421-11 SKYWORKS 22+ 56500 QFN16
TPS7A1111PDRVR TI 22+ 54000 WSON6
TLV62569PDDCR TI 22+ 52000 SOT23-6
TLV62569DBVR TI 22+ 48000 SOT23-5
TPS23753APWR TI 22+ 40000 TSSOP14
NB691GG-Z MPS 22+ 30000 QFN
SN74AHC1G02DBVR TI 22+ 27939 SOT-23
TPS63000DRCR TI 22+ 23238 VSON10
TLV75533PDRVR TI 22+ 21500 WSON6
NB687BGQ-Z MPS 22+ 20000 QFN
A3916GESTR-T-1 ALLEGRO 22+ 17150 QFN-20
TPS62135RGXR TI 22+ 15000 VQFN11
TLE2022AMDR TI 0803+ 12500 SOP8
TPS23756PWPR TI 22+ 12000 HTSSOP-20

Write your review

One stop electronic component supply Original DS38E16SBB-9MGB 2Gb DDR3L SDRAM FLASH IC CHIP FBGA 96

DS38E16SBB-9MGB-Nominal and dynamic on-die termination (ODT) for data, strobe, and mask signals

- Programmable CAS (READ) latency (CL)

- Programmable CAS additive latency (AL)

- Programmable CAS (WRITE) latency (CWL)

Write your review

Other Products In The same category:

1000In stock:
Can ship immediately
QUANTITY
All prices are in USD

SEND
RFQ