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IC KLMAG2GEND-B031 MLC NAND Flash Serial e-MMC 3V/3.3V 128G-bit 128G/32G/16G x 1/4-bit/8-bit 153-Pin FBGA T/R/Tray

Manufacturer
Manufacturer Product Number
KLMAG2GEND-B031
Description

MLC NAND Flash Serial e-MMC 3V/3.3V 128G-bit 128G/32G/16G x 1/4-bit/8-bit 153-Pin FBGA T/R/Tray

Package Condition
TRAY
Datasheet

Product Descriptions

SAMSUNG e·MMC is an embedded MMC solution designed in a BGA package form. e·MMC operation is identical to a MMC device and therefore is a simple read and write to memory using MMC protocol v5.0 which is a industry standard.

e·MMC consists of NAND flash and a MMC controller. 3V supply voltage is required for the NAND area (VDDF or VCC) whereas 1.8V or 3V dual supply voltage (VDD or VCCQ) is supported for the MMC controller. SAMSUNG e•MMC supports 200MHz 

DDR – up to 400MBps with bus widths of 8 bit in order to improve sequential bandwidth, especially sequential read performance.

There are several advantages of using e·MMC. It is easy to use as the MMC interface allows easy integration with any microprocessor with MMC host. 

Any revision or amendment of NAND is invisible to the host as the embedded MMC controller insulates NAND technology from the host. This leads to faster product development as well as faster times to market.

The embedded flash management software or FTL(Flash Transition Layer) of e·MMC manages Wear Leveling, Bad Block Management and ECC. The FTL supports all features of the Samsung NAND flash and achieves optimal performance.

Product Features

embedded MultiMediaCard Ver. 5.0 compatible. Detail description is referenced by JEDEC Standard

SAMSUNG e·MMC supports features of eMMC5.0 which are defined in JEDEC Standard

 - Supported Features : Packed command, Cache, Discard, Sanitize, Power Off Notification, Data Tag,

                                      Partition types, Context ID, Real Time Clock, Dynamic Device Capacity, HS200

 

 - Non-supported Features : Large Sector Size (4KB)

 

 Additional feature : HS400 mode (200MHz DDR - up to 400Mbps)

 

 Full backward compatibility with previous MultiMediaCard system specification (1bit data bus, multi-e·MMC systems) 

 

Data bus width : 1bit (Default), 4bit and 8bit

 

MMC I/F Clock Frequency : 0 ~ 200MHz 

 

MMC I/F Boot Frequency : 0 ~ 52MHz 

Temperature : Operation (-25C ~ 85C), Storage without operation (-40C ~ 85C) 

 

Power : Interface power → VDD(VCCQ) (1.70V ~ 1.95V or 2.7V ~ 3.6V) , Memory power → VDDF(VCC) (2.7V ~ 3.6V)

Specifications

Attribute Attribute value
ANSM-Part# ANSM-KLMAG2GEND-B031
ECCN (US) 3A991.b.1.a
Part Status Obsolete
Automotive No
PPAP No
Cell Type MLC NAND
Chip Density (bit) 128G
Architecture Sectored
Boot Block Yes
Number of Bits/Word (bit) 36989
Number of Words 128G/32G/16G
Programmability Yes
Timing Type Synchronous
Maximum Erase Time (S) 0.02
Interface Type Serial e-MMC
Maximum Operating Frequency (MHz) 200
Minimum Operating Supply Voltage (V) 2.7
Typical Operating Supply Voltage (V) 3|3.3
Maximum Operating Supply Voltage (V) 3.6
Minimum Operating Temperature (°C) -25
Maximum Operating Temperature (°C) 85
Command Compatible Yes
ECC Support Yes
Support of Page Mode No
Packaging Tape and Reel|Tray
Mounting Surface Mount
Package Height 0.48
Package Width 11.5
Package Length 13
PCB changed 153
Standard Package Name BGA
Supplier Package FBGA
Pin Count 153
Lead Shape Ball

Actual product photos

KLMAG2GEND-B031

Product Data Book:

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For more product information, please download the PDF

Payment&Transportation

详情8.1

Official Certificate&Certificate

详情页3.1

Multiple product supply

详情5.1

Company office environment

详情6.1

Warehouse Real Shot

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Standard packaging

详情9

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IC KLMAG2GEND-B031 MLC NAND Flash Serial e-MMC 3V/3.3V 128G-bit 128G/32G/16G x 1/4-bit/8-bit 153-Pin FBGA T/R/Tray

MLC NAND Flash Serial e-MMC 3V/3.3V 128G-bit 128G/32G/16G x 1/4-bit/8-bit 153-Pin FBGA T/R/Tray

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