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IC KLMAG2GEND-B031 MLC NAND Flash Serial e-MMC 3V/3.3V 128G-bit 128G/32G/16G x 1/4-bit/8-bit 153-Pin FBGA T/R/Tray
MLC NAND Flash Serial e-MMC 3V/3.3V 128G-bit 128G/32G/16G x 1/4-bit/8-bit 153-Pin FBGA T/R/Tray
Product Descriptions
SAMSUNG e·MMC is an embedded MMC solution designed in a BGA package form. e·MMC operation is identical to a MMC device and therefore is a simple read and write to memory using MMC protocol v5.0 which is a industry standard.
e·MMC consists of NAND flash and a MMC controller. 3V supply voltage is required for the NAND area (VDDF or VCC) whereas 1.8V or 3V dual supply voltage (VDD or VCCQ) is supported for the MMC controller. SAMSUNG e•MMC supports 200MHz
DDR – up to 400MBps with bus widths of 8 bit in order to improve sequential bandwidth, especially sequential read performance.
There are several advantages of using e·MMC. It is easy to use as the MMC interface allows easy integration with any microprocessor with MMC host.
Any revision or amendment of NAND is invisible to the host as the embedded MMC controller insulates NAND technology from the host. This leads to faster product development as well as faster times to market.
The embedded flash management software or FTL(Flash Transition Layer) of e·MMC manages Wear Leveling, Bad Block Management and ECC. The FTL supports all features of the Samsung NAND flash and achieves optimal performance.
Product Features
embedded MultiMediaCard Ver. 5.0 compatible. Detail description is referenced by JEDEC Standard
SAMSUNG e·MMC supports features of eMMC5.0 which are defined in JEDEC Standard
- Supported Features : Packed command, Cache, Discard, Sanitize, Power Off Notification, Data Tag,
Partition types, Context ID, Real Time Clock, Dynamic Device Capacity, HS200
- Non-supported Features : Large Sector Size (4KB)
Additional feature : HS400 mode (200MHz DDR - up to 400Mbps)
Full backward compatibility with previous MultiMediaCard system specification (1bit data bus, multi-e·MMC systems)
Data bus width : 1bit (Default), 4bit and 8bit
MMC I/F Clock Frequency : 0 ~ 200MHz
MMC I/F Boot Frequency : 0 ~ 52MHz
Temperature : Operation (-25C ~ 85C), Storage without operation (-40C ~ 85C)
Power : Interface power → VDD(VCCQ) (1.70V ~ 1.95V or 2.7V ~ 3.6V) , Memory power → VDDF(VCC) (2.7V ~ 3.6V)
Specifications
Attribute | Attribute value |
ANSM-Part# | ANSM-KLMAG2GEND-B031 |
ECCN (US) | 3A991.b.1.a |
Part Status | Obsolete |
Automotive | No |
PPAP | No |
Cell Type | MLC NAND |
Chip Density (bit) | 128G |
Architecture | Sectored |
Boot Block | Yes |
Number of Bits/Word (bit) | 36989 |
Number of Words | 128G/32G/16G |
Programmability | Yes |
Timing Type | Synchronous |
Maximum Erase Time (S) | 0.02 |
Interface Type | Serial e-MMC |
Maximum Operating Frequency (MHz) | 200 |
Minimum Operating Supply Voltage (V) | 2.7 |
Typical Operating Supply Voltage (V) | 3|3.3 |
Maximum Operating Supply Voltage (V) | 3.6 |
Minimum Operating Temperature (°C) | -25 |
Maximum Operating Temperature (°C) | 85 |
Command Compatible | Yes |
ECC Support | Yes |
Support of Page Mode | No |
Packaging | Tape and Reel|Tray |
Mounting | Surface Mount |
Package Height | 0.48 |
Package Width | 11.5 |
Package Length | 13 |
PCB changed | 153 |
Standard Package Name | BGA |
Supplier Package | FBGA |
Pin Count | 153 |
Lead Shape | Ball |
Actual product photos
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