Professional supply Integrated circuit IC TMS320F28335 C2000™ 32-bit MCU with 150 MIPS, FPU, 512 KB flash, EMIF, 12b ADC

Product Descriptions

C2000™ real-time microcontrollers are optimized for processing, sensing, and actuation to improve closed-loop performance in real-time control applications such as industrial motor drives; solar inverters and digital power; electrical vehicles and transportation; motor control; and sensing and signal processing. The C2000 line includes the Premium performance MCUs and the Entry performance MCUs.

The TMS320F28335, TMS320F28334, TMS320F28333, TMS320F28332, TMS320F28235, TMS320F28234, and TMS320F28232 devices are highly integrated, high-performance solutions for demanding control applications.

Throughout this document, the devices are abbreviated as F28335, F28334, F28333, F28332, F28235, F28234, and F28232, respectively. F2833x Device Comparison and F2823x Device Comparison provide a summary of features for each device.

The Getting Started With C2000™ Real-Time Control Microcontrollers (MCUs) Getting Started Guide covers all aspects of development with C2000 devices from hardware to support resources. In addition to key reference documents, each section provides relevant links and resources to further expand on the information covered.

To learn more about the C2000 MCUs, visit the C2000™ real-time control MCUs page.

Product Features

• High-performance static CMOS technology

  • Up to 150 MHz (6.67-ns cycle time)

  • 1.9-V/1.8-V core, 3.3-V I/O design

• High-performance 32-bit CPU (TMS320C28x)

  • IEEE 754 single-precision Floating-Point Unit (FPU) (F2833x only)

  • 16 × 16 and 32 × 32 MAC operations

  • 16 × 16 dual MAC

  • Harvard bus architecture

  • Fast interrupt response and processing

  • Unified memory programming model

  • Code-efficient (in C/C++ and Assembly)

• Six-channel DMA controller (for ADC, McBSP, ePWM, XINTF, and SARAM)

• 16-bit or 32-bit External Interface (XINTF)

  • More than 2M × 16 address reach

• On-chip memory

  • F28335, F28333, F28235: 256K × 16 flash, 34K × 16 SARAM

  • F28334, F28234: 128K × 16 flash, 34K × 16 SARAM

  • F28332, F28232: 64K × 16 flash, 26K × 16 SARAM

  • 1K × 16 OTP ROM

• Boot ROM (8K × 16)

  • With software boot modes (through SCI, SPI, CAN, I2C, McBSP, XINTF, and parallel I/O)

  • Standard math tables

• Clock and system control

  • On-chip oscillator

  • Watchdog timer module

• GPIO0 to GPIO63 pins can be connected to one of the eight external core interrupts

• Peripheral Interrupt Expansion (PIE) block that supports all 58 peripheral interrupts

• 128-bit security key/lock

  • Protects flash/OTP/RAM blocks

  • Prevents firmware reverse-engineering

• Enhanced control peripherals

  • Up to 18 PWM outputs

  • Up to 6 HRPWM outputs with 150-ps MEP resolution

  • Up to 6 event capture inputs

  • Up to 2 Quadrature Encoder interfaces

  • Up to 8 32-bit timers (6 for eCAPs and 2 for eQEPs)

  • Up to 9 16-bit timers (6 for ePWMs and 3 XINTCTRs)

• Three 32-bit CPU timers

• Serial port peripherals

  • Up to 2 CAN modules

  • Up to 3 SCI (UART) modules

  • Up to 2 McBSP modules (configurable as SPI)

  • One SPI module

  • One Inter-Integrated Circuit (I2C) bus

• 12-bit ADC, 16 channels

  • 80-ns conversion rate

  • 2 × 8 channel input multiplexer

  • Two sample-and-hold

  • Single/simultaneous conversions

  • Internal or external reference

• Up to 88 individually programmable, multiplexed GPIO pins with input filtering

• JTAG boundary scan support

  • IEEE Standard 1149.1-1990 Standard Test Access Port and Boundary Scan Architecture

• Advanced debug features

  • Analysis and breakpoint functions

  • Real-time debug using hardware

• Development support includes

  • ANSI C/C++ compiler/assembler/linker

  • Code Composer Studio™ IDE

  • DSP/BIOS™ and SYS/BIOS

  • Digital motor control and digital power software libraries

• Low-power modes and power savings

  • IDLE, STANDBY, HALT modes supported

  • Disable individual peripheral clocks

• Endianness: Little endian

• Package options:

  • Lead-free, green packaging

  • 176-ball plastic Ball Grid Array (BGA) [ZJZ]

  • 179-ball MicroStar BGA™ [ZHH]

  • 179-ball New Fine Pitch Ball Grid Array (nFBGA) [ZAY]

  • 176-pin Low-Profile Quad Flatpack (LQFP) [PGF]

  • 176-pin Thermally Enhanced Low-Profile Quad Flatpack (HLQFP) [PTP]

• Temperature options:

  • A: –40°C to 85°C (PGF, ZHH, ZAY, ZJZ)

  • S: –40°C to 125°C (PTP, ZJZ)

  • Q: –40°C to 125°C (PTP, ZJZ) (AEC Q100 qualification for automotive applications)

Specifications

Actual product photos

Product Data Book：

For more product information, please download the PDF

Payment&Transportation

Official Certificate&Certificate

Multiple product supply

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Warehouse Real Shot

Standard packaging

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