Hot-selling and scarce LFE3-70EA-8FN672C Field Programmable Gate Array IC BGA spot stock

Product Descriptions

The FPGA devices is optimized to deliver high performance features such as an enhanced DSP architecture, high speed SERDES and high speed source synchronous interfaces in an economical FPGA fabric . This combination is achieved through advances in device architecture and the use of 65 nm technology making the devices suitable for high-volume, high-speed, low-cost applications .

Product Features

 Higher Logic Density for Increased System Integration

•  17K to 149K LUTs

•  116 to 586 I/Os

 Embedded SERDES

•  150 Mbps to 3.2 Gbps for Generic 8b10b, 10-bit SERDES, and 8-bit SERDES modes

•  Data Rates 230 Mbps to 3.2 Gbps per channel for all other protocols

•  Up to 16 channels per device: PCI Express, SONET/SDH, Ethernet (1GbE, SGMII, XAUI), CPRI, SMPTE 3G and Serial RapidIO

 sysDSP™

•  Fully cascadable slice architecture

•  12 to 160 slices for high performance multiply and accumulate

•  Powerful 54-bit ALU operations

• Time Division Multiplexing MAC Sharing

•  Rounding and truncation

•  Each slice supports

—Half 36x36,two 18x18 or four 9x9 multipliers

—Advanced 18x36 MAC and 18x18 Multiply Multiply-Accumulate (MMAC)operations

 Flexible Memory Resources

•  Up to 6.85Mbits sysMEM™ Embedded Block RAM (EBR)

• 36K to 303K bits distributed RAM

 sysCLOCK Analog PLLs and DLLs

• Two DLLs and up to ten PLLs per device

 Pre-Engineered Source Synchronous I/O

•  DDR registers in I/O cells

•  Dedicated read/write levelling functionality

•  Dedicated gearing logic

•  Source synchronous standards support

—ADC/DAC, 7:1 LVDS, XGMII

—High Speed ADC/DAC devices

•  Dedicated DDR/DDR2/DDR3 memory with DQS support

•  Optional Inter-Symbol Interference (ISI) correction on outputs

Product Specification

Product Photos

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