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Hot selling MPU-9250 silk screen MP92 9-axis gyroscope sensor chip IC quality assurance
MPU-9250 silk screen MP92 9-axis gyroscope sensor
Product Descriptions
MPU-9250 is a multi-chip module (MCM) consisting of two dies integrated into a single QFN package. One die houses the 3-Axis gyroscope
and the 3-Axis accelerometer. The other die houses the AK8963 3-Axis magnetometer from Asahi Kasei Microdevices Corporation. Hence, the
MPU-9250 is a 9-axis MotionTracking device that combines a 3-axis gyroscope, 3-axis accelerometer, 3-axis magnetometer and a Digital Motion
Processor™ (DMP) all in a small 3x3x1mm package available as a pin-compatible upgrade from the MPU6515. With its dedicated I2C sensor
bus, the MPU-9250 directly provides complete 9-axis MotionFusion™output.
The MPU-9250 MotionTracking device, with its 9-axis integration, on-chip MotionFusion™, and runtime calibration firmware, enables
manufacturers to eliminate the costly and complex selection, qualification, and system level integration of discrete devices, guaranteeing
optimal motion performance for consumers.
MPU-9250 is also designed to interface with multiple non-inertial digital sensors, such as pressure sensors, on its auxiliary I2C port.
MPU-9250 features three 16-bit analog-to-digital converters (ADCs) for digitizing the gyroscope outputs, three 16-bit ADCs for digitizing the
accelerometer outputs, and three 16-bit ADCs for digitizing the magnetometer outputs. For precision tracking of both fast and slow motions,
the parts feature a user-programmable gyroscope full-scale range of ±250, ±500, ±1000, and ±2000°/sec (dps), a user-programmable
accelerometer full-scale range of ±2g, ±4g, ±8g, and ±16g, and a magnetometer full-scale range of ±4800µT.
Other industry-leading features include programmable digital filters, a precision clock with 1% drift from -40°C to 85°C, an embedded
temperature sensor, and programmable interrupts. The device features I2C and SPI serial interfaces, a VDD operating range of 2.4V to 3.6V, and
a separate digital IO supply, VDDIO from 1.71V to VDD.
Communication with all registers of the device is performed using either I2C at 400kHz or SPI at 1MHz. For applications requiring faster
communications, the sensor and interrupt registers may be read using SPI at 20MHz.
By leveraging its patented and volume-proven CMOS-MEMS fabrication platform, which integrates MEMS wafers with companion CMOS
electronics through wafer-level bonding, InvenSense has driven the package size down to a footprint and thickness of 3x3x1mm, to provide a
very small yet high performance low cost package. The device provides high robustness by supporting 10,000g shock reliability.
Product Applications
Location based services, points of interest, and dead reckoning
Handset and portable gaming
Motion-based game controllers
3D remote controls for Internet connected DTVs and set top boxes, 3D mice
Wearable sensors for health, fitness and sports
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