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Exact specifications should be obtained from the product data sheet.

Hot selling original KLMAG2GEND-B031 MLC NAND Flash Serial e-MMC 3V/3.3V 128G-bit 1/4-bit/8-bit 153FBGA quality assurance

Manufacturer Product Number
KLMAG2GEND-B031
Description

KLMAG2GEND-B031 MLC NAND Flash Serial e-MMC 3V/3.3V 128G-bit 1/4-bit/8-bit 153FBGA

Package Condition
BGA153
Datasheet

Product Features

  • embedded MultiMediaCard Ver. 5.0 compatible. Detail description is referenced by JEDEC Standard

  • SAMSUNG e·MMC supports features of eMMC5.0 which are defined in JEDEC Standard

 - Supported Features : Packed command, Cache, Discard, Sanitize, Power Off Notification, Data Tag,

                                      Partition types, Context ID, Real Time Clock, Dynamic Device Capacity, HS200

 

 - Non-supported Features : Large Sector Size (4KB)

 

  •  Additional feature : HS400 mode (200MHz DDR - up to 400Mbps)

 

  • Full backward compatibility with previous MultiMediaCard system specification (1bit data bus, multi-e·MMC systems) 

  • Data bus width : 1bit (Default), 4bit and 8bit

  • MMC I/F Clock Frequency : 0 ~ 200MHz 

       MMC I/F Boot Frequency : 0 ~ 52MHz 

  • Temperature : Operation (-25C ~ 85C), Storage without operation (-40C ~ 85C

  • Power : Interface power → VDD(VCCQ) (1.70V ~ 1.95V or 2.7V ~ 3.6V) , Memory power → VDDF(VCC) (2.7V ~ 3.6V)

Specifications

Attribute Attribute value
Model ANSC-M24082073
Product Name KLMAG2GEND-B031
ECCN (US) 3A991.b.1.a
Part Status Obsolete
Automotive No
PPAP No
Cell Type MLC NAND
Chip Density (bit) 128G
Architecture Sectored
Boot Block Yes
Number of Bits/Word (bit) 36989
Number of Words 128G/32G/16G
Programmability Yes
Timing Type Synchronous
Maximum Erase Time (S) 0.02
Interface Type Serial e-MMC
Minimum Operating Supply Voltage (V) 2.7
Maximum Operating Frequency (MHz) 200
Typical Operating Supply Voltage (V) 3|3.3
Maximum Operating Supply Voltage (V) 3.6
Minimum Operating Temperature  (°C) -25
Maximum Operating Temperature (°C) 85
Command Compatible Yes
ECC Support Yes
Support of Page Mode No
Packaging Tape and Reel|Tray
Mounting Surface Mount
Package Height 0.48
Package Width 11.5
Package Length 13
PCB changed 153
Standard Package Name BGA
Supplier Package FBGA
Pin Count 153
Lead Shape Ball

Actual product photos

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Product Data Manual:

搜狗高速浏览器截图20240820134800

搜狗高速浏览器截图20240820134805

搜狗高速浏览器截图20240820134811

​For more product information, please download the PDF

Payment&Transportation

详情8.1

Official Certificate&Certificate

详情页3.1

Multiple product supply

详情5.1

Company office environment

详情6.1

Warehouse Real Shot

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Standard packaging

详情9

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Hot selling original KLMAG2GEND-B031 MLC NAND Flash Serial e-MMC 3V/3.3V 128G-bit 1/4-bit/8-bit 153FBGA quality assurance

KLMAG2GEND-B031 MLC NAND Flash Serial e-MMC 3V/3.3V 128G-bit 1/4-bit/8-bit 153FBGA

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