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Hot-selling and scarce XC7Z035-1FBG676I System On Chip 676FCBGA spot stock

Manufacturer Product Number
XC7Z035-1FBG676I
Description

XC7Z035-1FBG676I System On Chip 676FCBGA spot stock

Package Condition
Tray
Datasheet
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Product Features

Caches

•      32 KB Level 1 4-way set-associative instruction and data caches

(independent for each CPU)

•      512 KB 8-way set-associative Level 2 cache

(shared between the CPUs)

•       Byte-parity support

On-Chip Memory

•      On-chip boot ROM

•      256 KB on-chip RAM (OCM)

•       Byte-parity support

Product Specifications

Attribute Attribute value
ANSM-Part# ANSM-XC7Z035-1FBG676I
Category Integrated Circuits (ICs)
Embedded
System On Chip (SoC)
Manufacturer -
Series Zynq®-7000
Packaging Tray
Part Status Active
Architecture MCU, FPGA
Core Processor Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
RAM Size 256KB
Peripherals DMA
Connectivity CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed 667MHz
Primary Attributes Kintex™-7 FPGA, 275K Logic Cells
Operating Temperature -40°C ~ 100°C (TJ)
Package / Case 676-BBGA, FCBGA
Supplier Device Package 676-FCBGA (27x27)
Number of I/O 130
Base Product Number XC7Z035

Product Photos

XC7Z035-1FBG676I

For more product information, please download the PDF

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Hot-selling and scarce XC7Z035-1FBG676I System On Chip 676FCBGA spot stock

XC7Z035-1FBG676I System On Chip 676FCBGA spot stock

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