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Hot selling LSM6DS3TR acceleration+gyroscopic sensor chip motion and positioning sensor quality assurance

Manufacturer Product Number
LSM6DS3TR
Description

LSM6DS3TR acceleration+gyroscopic sensor chip

Package Condition
original
Datasheet

Product Descriptions

The LSM6DS3 is a system-in-package featuring a 3D digital accelerometer and a 3D digital gyroscope performing at 1.25 mA (up to 1.6 kHz 

ODR) in highperformance mode and enabling always-on low-power features for an optimal motion experience for the consumer.

The LSM6DS3 supports main OS requirements, offering real, virtual and batch sensors with 8 kbyte for dynamic data batching. ST’s family of 

MEMS sensor modules leverages the robust and mature manufacturing processes already used for the production of micromachined

accelerometers and gyroscopes.

The various sensing elements are manufactured using specialized micromachining processes, while the IC interfaces are developed using CMOS 

technology that allows the design of a dedicated circuit which is trimmed to better match the characteristics of the sensing element.

The LSM6DS3 has a full-scale acceleration range of ±2/±4/±8/±16 g and an angular rate range of ±125/±250/±500/±1000/±2000 dps.

High robustness to mechanical shock makes the LSM6DS3 the preferred choice of system designers for the creation and manufacturing of 

reliable products. The LSM6DS3 is available in a plastic land grid array (LGA) package.

Product Features

 Power consumption: 0.9 mA in combo normal mode and 1.25 mA in combo high-performance mode up to 1.6 kHz.

 “Always-on” experience with low power consumption for both accelerometer and gyroscope

 Smart FIFO up to 8 kbyte based on features set

 Compliant with Android K and L

 Hard, soft ironing for external magnetic sensor corrections

 ±2/±4/±8/±16 g full scale

 ±125/±250/±500/±1000/±2000 dps full scale

 Analog supply voltage: 1.71 V to 3.6 V

 Independent IOs supply (1.62 V)

 Compact footprint, 2.5 mm x 3 mm x 0.83 mm

 SPI/I2C serial interface with main processor data synchronization feature

 Embedded temperature sensor

 ECOPACK®, RoHS and “Green” compliant

Product Applications

 Pedometer, step detector and step counter

 Significant motion and tilt functions

 Indoor navigation

 Tap and double-tap detection

 IoT and connected devices

 Intelligent power saving for handheld devices

 Vibration monitoring and compensation

 Free-fall detection

 6D orientation detection

Product Images

LSM6DS3TR

Payment&Transportation

详情8.1

Official Certificate&Certificate

详情页3.1

Multiple product supply

详情5.1

Company office environment

详情6.1

Warehouse Real Shot

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Standard packaging

详情9

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Hot selling LSM6DS3TR acceleration+gyroscopic sensor chip motion and positioning sensor quality assurance

LSM6DS3TR acceleration+gyroscopic sensor chip

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