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HC-07 Bluetooth module... HC-07 (main) patch version

HC-07 spp2.0 master-slave Bluetooth module

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$5.63
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HC-06 Bluetooth module... HC-06D with bottom plate welding pin

HC-06 spp2.0 master-slave integrated Bluetooth module

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$5.63
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HC-06 Bluetooth module... HC-06D with bottom plate No soldering pins

HC-06 spp2.0 master-slave integrated Bluetooth module

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HC-06 Bluetooth module... HC-06 patch model

HC-06 spp2.0 master-slave integrated Bluetooth module

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Original stock sale... E22-900M30S

E22 series is the first wireless module in China to adopt Semtech's SX1262, SX1268 RF chip.

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Hot selling original stock... E22-400M30S

The E22 series is the first wireless module in China to adopt Semtech's SX1262, SX1268 RF chip. This chip provides a variety of modulation methods

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Hot selling E22-900M22S... E22-900M22S

E22 series is the first wireless module in China to adopt Semtech's SX1262, RF chip. Its special LoRaTM modulation method increases the communication distance.

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Original stock sale... E22-400M22S

The E22 series is the first wireless module in China to adopt Semtech's SX1262, SX1268 RF chip. This chip provides a variety of modulation methods, such as LoRaTM and traditional GFSK.

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E220 LoRa series module... E220-900MBL-02

The MBL series evaluation kits are designed to help users quickly evaluate next-generation package-compatible wireless modules

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E220-400MBL-02 E220 series... E220-400MBL-02

The MBL series evaluation kits are designed to help users quickly evaluate next-generation package-compatible wireless modules.

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E220-900MBL-01 Lora llcc68... E220-900MBL-01

E220-900MBL-01 development evaluation kit

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Original stock sale... E220-400MBL-01

E220-400MBL-01 is an small module developed independently based on the generation of LoRa TM RF chip LLCC68 produced

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