Hot sale Original H5TQ4G63AFR-PBC DDR DRAM 256MX16 0.225ns CMOS PBGA96 HALOGEN FREE AND FBGA-96

Manufacturer Product Number

H5TQ4G63AFR-PBC

Description

H5TQ4G63AFR-PBC DDR DRAM 256MX16 0.225ns CMOS PBGA96 HALOGEN FREE AND FBGA-96

Package Condition

Original

Product Details
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Product Description

Type#	Description
ANSC PART#	ANSC- H5TQ4G63AFR-PBC
Ihs Manufacturer	Original
Part Package Code	BGA
Package Description	HALOGEN FREE AND ROHS COMPLIANT, FBGA-96
Pin Count	96
Samacsys Manufacturer	Hynix
Access Mode	MULTI BANK PAGE BURST
Access Time-Max	0.225 ns
Additional Feature	AUTO/SELF REFRESH
Clock Frequency-Max (fCLK)	800 MHz
I/O Type	COMMON
Interleaved Burst Length	4,8
JESD-30 Code	R-PBGA-B96
Length	13 mm
Memory Density	4294967296 bit
Memory IC Type	DDR3 DRAM
Memory Width	16
Number of Functions	1
Number of Ports	1
Number of Terminals	96
Number of Words	268435456 words
Number of Words Code	256000000
Operating Mode	SYNCHRONOUS
Operating Temperature-Max	85 °C
Operating Temperature-Min
Organization	256MX16
Output Characteristics	3-STATE
Package Body Material	PLASTIC/EPOXY
Package Code	TFBGA
Package Equivalence Code	BGA96,9X16,32
Package Shape	RECTANGULAR
Package Style	GRID ARRAY, THIN PROFILE, FINE PITCH
Peak Reflow Temperature (Cel)	NOT SPECIFIED
Qualification Status	Not Qualified
Refresh Cycles	8192
Seated Height-Max	1.2 mm
Self Refresh	YES
Sequential Burst Length	4,8
Standby Current-Max	0.017 A
Supply Current-Max	0.22 mA
Supply Voltage-Max (Vsup)	1.575 V
Supply Voltage-Min (Vsup)	1.425 V
Supply Voltage-Nom (Vsup)	1.5 V
Surface Mount	YES
Technology	CMOS
Temperature Grade	OTHER
Terminal Form	BALL
Terminal Pitch	0.8 mm
Terminal Position	BOTTOM
Time@Peak Reflow Temperature-Max (s)	NOT SPECIFIED
Width	9 mm

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H5TQ4G63AFR-PBC

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