Hot-selling and scarce N25Q064A13EF840F 3V Multiple I/O 4KB Sector Erase QFN spot stock

Product Features

• 108 MHz (MAX) clock frequency

• 2.7–3.6V single supply voltage

• Dual/quad I/O instruction provides increased throughput up to 432 MHz

• Supported protocols

– Extended SPI, dual I/O, and quad I/O

• Execute-in-place (XIP) mode for all three protocols

– Configurable via volatile or nonvolatile registers

– Enables memory to work in XIP mode directly af ter power-on

• PROGRAM/ERASE SUSPEND operations

• Continuous read of entire memory via a single com mand

– Fast read

– Quad or dual output fast read

– Quad or dual I/O fast read

• Flexible to fit application

– Configurable number of dummy cycles

– Output buffer configurable

• 64-byte, user-lockable, one-time programmable (OTP) dedicated area

• Erase capability

– Subsector erase 4KB uniform granularity blocks

– Sector erase 64KB uniform granularity blocks

– Full-chip erase

• Write protection

– Software write protection applicable to every 64KB sector via volatile lock bit

– Hardware write protection: protected area size defined by five nonvolatile bits (BP0, BP1, BP2, BP3, and TB)

– Additional smart protections, available upon re quest

• Electronic signature

– JEDEC-standard 2-byte signature (BA17h)

– Unique ID code (UID): 17 read-only bytes, in cluding:

• Two additional extended device ID (EDID) bytes to identify device factory options

• Customized factory data (14 bytes)

• Minimum 100,000 ERASE cycles per sector

• More than 20 years data retention

• Packages JEDEC standard, all RoHS compliant

– F6 = V-PDFN-8 6mm x 5mm (MLP8 6mm x 5mm)

– F8 = V-PDFN-8 8mm x 6mm (MLP8 8mm x 6mm)

– 12 = T-PBGA-24b05 6mm x 8mm

– 14 = T-PBGA-24b05 6mm x 8mm, 4x6 ball array

– SF = SOP2-16 300 mils body width (SO16W)

– SE = SOP2-8 208 mils body width (SO8W)

Product Photos

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