Professional supply BCM56990B0KFLGG SCALABLE 12-PORT GIGABIT ETHERNET MULTILAYER SWITCH BGA

Product Descriptions

The Broadcom® BCM56990 family is a class of high-radix, high-bandwidth network switching devices supporting up to 64 × 400GbE, 128 × 200GbE, 256 × 100GbE, 256 × 40GbE, 256 × 25GbE, or 256 × 10GbE ports. The device family features a maximum of 64 integrated Blackhawk7 (50G-PAM4) or 32 Osprey (100G-PAM4) SerDes cores, and associated PCS for native support of numerous physical connectivity options, enabling a broad range of media, speed, and reach. The BCM56990 delivers high-bandwidth, glueless network connectivity up to 25.6 Tb/s on a single chip.

The BCM56990 is a high-performance and high-capacity device designed to meet the requirements for next-generation data center and cloud computing environments. The BCM56990 architecture delivers complete L2 and L3 switching, routing and tunneling capabilities at line rate and maximum port density, with low power and latency. Software compatibility is maintained across the StrataXGS® product portfolio to simplify customer designs and reduce customer time-to-market.

Product Features

• Enables the next generation of high-throughput, low latency hyperscale networks with up to 64 ports of 400GbE switching and routing

• Support for up to 256 ports of 100GbE ports, enabling low-latency, single-hop networks for massive alternative compute clusters

• Robust connectivity the industry’s highest performance and longest-reach 50G-PAM4 or 100G-PAM4 SerDes cores, enabling long-reach (LR) East-West optical links and Direct-Attached-Copper (DAC) in-rack cabling in the data center

• The industry’s most advanced shared-buffer architecture, offering up to 10X higher incast absorption and providing the highest performance and lowest end-to-end latency for RoCEv2 workloads

• New advanced load balancing mechanisms, virtually eliminating hash polarization and providing extremely efficient, controllable link utilization

• Advanced congestion management, enabling new traffic management paradigms

• Industry-leading instrumentation including IFA 2.0 for inband telemetry, postcards for out-of-band telemetry, SerDes link quality meters, and visibility into all on-chip packet drops and congestion events

• Four 1 GHz ARM processors for high-bandwidth, fully-programmable streaming telemetry and sophisticated embedded applications such as on-chip statistics summarization

• Implemented with unparalleled power efficiency in a monolithic 7nm die

Product Features

• Single-chip solution for data center top of rack, aggregation, edge, and spine switches

• Data center fixed and chassis/modular switches

• Deep learning networks

• NVMe storage disaggregation

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