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E22-170M33S ultra small size and suitable for 170.125MHz surface mount LoRa wireless module
Manufacturer Product Number
E22-170M30S
Description
E22-170M30S is a self-developed ultra small size based on the new generation LoRaTM RF chip SX1262, and is suitable for 170.125MHz surface mount LoRa wireless modules.
Package Condition
Bulk
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Product Descriptions
E22-170M30S is a self-developed ultra small size based on the new generation LoRaTM RF chip SX1262, and is suitable for 170.125MHz surface mount LoRa wireless modules. Due to the use of the original imported SX1262 as the module core, the anti-interference performance and communication distance have been further improved compared to the previous generation LoRaTM transceiver. Due to its adoption of the new LoRaTM modulation technology, its anti-interference performance and communication distance far exceed those of current FSK and GFSK modulation methods. This LoRa module is mainly designed for smart homes, wireless meter reading, scientific research and medical, as well as long-distance wireless communication devices.
Specifications
| Attribute | Attribute value | |
| ANSM-Part# | ANSM-E22-170M33S | |
| 发射功率 Transmission power |
33dBm | |
| 通信距离 Communication distance |
16km | |
| 产品尺寸 Product size |
24*38.5mm | |
| 产品重量 Product weight |
5.1±0.2g | |
| 工作频段 Working frequency band |
150.125～170.125MHz | 出厂默认170.125MHz，信道间隔250KHz Factory default 170.125MHz, channel spacing 250KHz |
| 空中速率 Air speed |
0.018～62.5k bps | 用户编程控制 User programming control |
| 芯片 Chip |
SX1262 | |
| FIFO | 256Byte | 单次发送最大长度 Maximum length for a single transmission |
| 调制方式 Modulation Type |
LoRa™ | 新一代LoRa™调制技术 New generation LoRa ™ modulation technique |
| 接口方式 Interface method |
邮票孔 Stamp hole |
间距1.27mm Distance 1.27mm |
| 通信接口 Communication interface |
SPI | 参考SPI速率为3M The reference SPI rate is 3M |
| 封装方式 Packaging method |
贴片 Surface mount |
|
| 天线接口 Antenna interface |
IPEX一代/邮票孔 IPEX Generation 1/Stamp Hole |
特性阻抗约50 欧姆 Characteristic impedance of approximately 50 ohms |
| 电气参数 Electrical parameters |
数值 Numerical value |
备注 Notes |
|
| 工作电压 Working voltage |
3.3～5.5V | 工作电压≥5V时，能满足输出功率需求，工作电压超过5.5V时有烧毁风险。 When the working voltage is ≥ 5V, it can meet the output power requirements, but there is a risk of burning when the working voltage exceeds 5.5V. |
|
| 通信电平 Communication level |
3.3V | 使用5V TTL 有风险烧毁 There is a risk of burning out when using 5V TTL |
|
| 功耗 Power consumption |
发射电流 Emission Current |
12OOmA | 瞬时功耗 Instantaneous power consumption |
| 接收电流 Receive current |
15mA | ||
| 休眠电流 Sleep current |
2μA | 软件关断 Software shutdown |
|
| 温度 Temperature |
工作温度 Working temperature |
-20℃～+85℃ | 工业级 Industrial grade |
| 储存温度 Storage temperature |
-40℃～+125℃ | ||
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E22-170M30S is a self-developed ultra small size based on the new generation LoRaTM RF chip SX1262, and is suitable for 170.125MHz surface mount LoRa wireless modules.
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