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Hot-selling and scarce XCZU9EG-L1FFVB1156I System On Chip BGA spot stock

Manufacturer Product Number
XCZU9EG-L1FFVB1156I
Description

XCZU9EG-L1FFVB1156I System On Chip BGA spot stock

Package Condition
Tray
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Product Specification

Attribute Attribute value
ANSM-Part# ANSM-XCZU9EG-L1FFVB1156I
Category Integrated Circuits (ICs)
Embedded
System On Chip (SoC)
Manufacturer -
Series Zynq® UltraScale+™ MPSOC EG
Packaging Bulk
Part Status Active
Architecture MCU, FPGA
Core Processor Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
RAM Size 256KB
Peripherals DMA, WDT
Connectivity CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed 500MHz, 600MHz, 1.2GHz
Primary Attributes Zynq®UltraScale+™ FPGA, 599K+ Logic Cells
Operating Temperature -40°C ~ 100°C (TJ)
Package / Case 1156-BBGA, FCBGA
Supplier Device Package 1156-FCBGA (35x35)
Number of I/O 328
Base Product Number XCZU9

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XCZU9EG-L1FFVB1156I

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Hot-selling and scarce XCZU9EG-L1FFVB1156I System On Chip BGA spot stock

XCZU9EG-L1FFVB1156I System On Chip BGA spot stock

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